Modified copper (high copper based alloys) are used in structural parts and friction materials. The aimof this study was to evaluate the effect of adding small amount ofAl, Ge, Mn, Ni and Sn on microstructure, electrochemical corrosion behavior, hardness and thermal properties of copper. Crystal size of Cu decreased but lattice microstrain increasedafter adding small amount ofAl, Ge,Mn, Ni. Corrosion resistance of Cu decreased after addingAl, Ge, Mn,Ni and Sn.Nickel, Germaniumand tin have a high latticemicrostrain and lowest corrosion rate. Differential scanning calorimeter shows a change in endothermal peak of copper based alloys which correlated to alloy composition and that is agreed with x-ray and scanning electronmicroscope analysis.Asignificant increase in copper strength after adding small amount ofAl, Ge,Mn, Ni and Sn especially Sn element.