Effects of Y2O3 contents on microstructure and hardness properties of Sn-Ag-Cu-Y2O3 composite solders

Author(s): EmadM.Ahmed

In this study, varyingof Y2O3particles from 0 to 1 wt.% were incorporated intoSn-1Ag-0.5Cu (SAC-0) plain solder matrix to form composite solders of 0.2 wt.%Y2O3 (SAC-0.2), 0.5wt.%Y2O3(SAC-0.5) and 1wt.%Y2O3 (SAC- 1). Optical (OM) and scanning electron microscopy (SEM) photographs show thatY2O3 particles depressed clearly the growth dendrite â-Sn grains. Since the Y2O3 particles serve as additionalnucleation sites for the formation of primary Sn-rich phase,the size of â-Sn grains were decreasedgradually from 10-15 toµm 2-5 µm range, while the eutectic areas around the â-Sn grainwere shrunkwith higher density of intermetallic particles and Y2O3 particles. XRD results confirmed mainly the presence of â-Sn, Ag3Snphases in all composite solders and the presence of Y2O3 clearly in SAC-1 composite solder. Moreover, lattice parameter of â-Sn was decreased by increasing of Y2O3content in the composite solders referring toenhancement ofCu solubilityin â-Sn for composite solders of higherY2O3content. Thismicrostructure improvement of composite solders leads to microhardness enhancement of SAC-0.2, SAC-0.5 and SAC-1 composite solders with 10.6%, 16.3% and 29% compared to the plain solders SAC-0, respectively.

Share this       

Share this Page.

Table of Contents

izmir escort izmir escort bursa escort antalya escort izmir escort porno porno izle türk porno eskişehir escort bartın escort burdur escort izmir escort bursa escort porno indir izle escort izmir