Abstract

Synthesis and study ofmicro-structure properties of SiO2 incorporated polyimide based high temperature resistive nano composite films

Author(s): D.Shrivastava, Anand Kumar Gupta, J.M.Keller, R.Bajpai

The PI/SiO2 nano-composite films were prepared using In-situ Generated Nano-Phase Structure (IGNPS) approach from the precursor solution of polyimide (PI) and tetraethoxysilane (TOES). For developing PI/SiO2 nanocomposite films, alkoxysilanewhich is precursor to tetraethoxysilane (TEOS) was blended with polyamic acid a precursor to PI in an ultra low concentration. FT-IR study was performed to assess the formation of nano-composite films. The silica nano particles were evaluated usingAFMtechnique. Thermal stability of composite films was analyzed using TGA characterization. Microhardness, tensile strength, tensile modulus and elongation were investigated to study the micromechanical performance of nano-composite films. The increase in value of hardness (Hv) and tensile strength for composite films were observed in comparison to pure PI with better thermal stability and lowwater absorption. The synergistic improvement in PI/TEOS composite filmswere attribute due to the formation of Si-O-Si particleswithin the PImatrix.


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