Structural, electrical, mechanical and soldering properties of new proposed Tin-Zinc-Cadmium lead free solder alloys

Author(s): Abu Bakr El-Bediwi, N.A.El-Shishtawi, Aia Abd El-Baset

The aimof present work was to produce new Sn-Zn-Cd alloy with superior soldering properties.Microstructure, electrical resistivity, elastic modulus, internal friction, thermal diffusivity, hardness, melting point, pasty range and wettability of Sn91Zn9-xCdx (x= 0, 1.5, 3, 5wt.%) and Sn86Zn4Cd10 rapidly solidified alloys have been investigated. Melting point, contact angle and elastic modulus values of Sn91Zn9-xCdx alloy decreased but electrical resistivity, internal friction and pasty range values increased with increasing cadmiumcontent. The Sn86Zn4Cd10 alloy has the beast soldering properties for electronic application.

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