Surface roughness of nickel/copper nanostructuresAuthor(s): Kgalemo Nthutang Kutuso
Nickel/Copper (Ni/Cu) nanostructures with constant total nominal thickness were fabricated with different Ni and Cu layers of equal thickness in the ratio of 1:1 per nanostructure. Throughout the study, the total nominal thickness was kept at 2 400Aï°whilst the Ni/Cu layers were varied maintaining the 1:1 ratio of the Ni and Cu layer thicknesses. The surfaces of the nanostructures were characterised using the Atomic Force Microscope. It was found that the surface roughness behaved differently for Ni and Cu layers less 5Aï° than that of Ni and Cu layers greater than 5Aï°.