The aim of present work was to improve physical and soldering properties of Sn-Ag eutectic alloy by adding cadmiumcontent to it. Structural, electrical resistivity, elastic and soldering properties of Sn96.5-xAg3.5Cdx (x= 0, 2.5, 4.5, 6.5, 8.5 wt.%) and Sn88Ag2Cd10 rapidly solidified alloys have been investigated. Melting point, contact angle, elastic modulus values of Sn96.5Ag3.5 alloy decreased but electrical resistivity increased by adding cadmiumcontent it. Pasty range, internal friction and thermal diffusivity of Sn96.5Ag3.5 alloy varied by adding cadmium content. The Sn88Ag2Cd10 alloy has beast soldering properties for electronic application.