Arylhydrazino-bismaleimides (AHBM) has been prepared by the Michael addition reaction of various phenyl hydrazine derivatives with N, N' -(4, 4' -biphenyl) bismaleimide (BBM). These arylhydrazino bismaleimides (AHBM) were employed for curing commercial epoxy resins. The curing behavior of commercial epoxy resin with these AHBM compounds using 2- methyl imidazole as a catalyst has been monitored using differential scanning calorimetry. Glass fiber composites of the epoxy AHBM system have also been prepared and characterized mechanically and chemically. The electrical conductivity of all unreinforced epoxy-AHBM cured products were measured at a room temperature and it was found that the produced cured materials were having good chemical resistance, good mechanical strength and low conductivity.